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> Training IPC-J-STD-001-CIS
Training IPC-J-STD-001-CIS
Requirements for soldering of electrical and electronic assemblies
Training purpose
  • Gaining comprehensive knowledge covering theory and practical advices about thru hole and surface mount components assembly as well as wires and cables.

Training time length

  • Number of hours: program dependent - modularity of training

Training program

Module I -€“ theory
  • Intr oduction
  • Products classes and acceptability states according to IPC
  • Classification of printed circuit boards
  • General requirements related to safety, equipment, materials, electostatic discharges
  • General requirements related to solder connections
  • General requirements related to thru hole and surface mounted components, wires and cables
  • Process requirements related to cleaning of electronic packets
  • Requirements for coating layers
  • Assurance of production quality: testing methods, using statistic control process
  • Examination
Module II -€“ theoretically-practical classes
  • Soldering of wires to different types of terminals
Module III -€“ theoretically-practical classes
  • Mounting of components made in thru hole technology
Module IV -€“ theoretically-practical classes
  • Mounting of components made in surface mount technology
Module IV -€“ theoretically classes
  • Methodology of inspection: requirements for thru hole and surface mount components assembly as well as wires and cables

Training destined for persons

  • Directly involved in mounting or control of printed circuit s boards made in PTH and SMT technology
  • Directly involved in mounting or control of connections made by using wires and cables

Advantages for participants

  • Knowledge about mounting criteria of printed circuits made in surface mount and thru hole technology as well as wires and cables in accordance with international standards
  • Getting textbooks with didactic materials
  • Will receive personal, international certificate of finishing IPC-J-STD-001 Certified IPC Specialist.