Training purpose
- Gaining comprehensive knowledge covering theory and practical advices about thru hole and surface mount components assembly as well as wires and cables.
Training time length
- Number of hours: program dependent - modularity of training
Training program Module I - theory
- Intr oduction
- Products classes and acceptability states according to IPC
- Classification of printed circuit boards
- General requirements related to safety, equipment, materials, electostatic discharges
- General requirements related to solder connections
- General requirements related to thru hole and surface mounted components, wires and cables
- Process requirements related to cleaning of electronic packets
- Requirements for coating layers
- Assurance of production quality: testing methods, using statistic control process
- Examination
Module II - theoretically-practical classes
- Soldering of wires to different types of terminals
Module III - theoretically-practical classes
- Mounting of components made in thru hole technology
Module IV - theoretically-practical classes
- Mounting of components made in surface mount technology
Module IV - theoretically classes
- Methodology of inspection: requirements for thru hole and surface mount components assembly as well as wires and cables
Training destined for persons
- Directly involved in mounting or control of printed circuit s boards made in PTH and SMT technology
- Directly involved in mounting or control of connections made by using wires and cables
Advantages for participants
- Knowledge about mounting criteria of printed circuits made in surface mount and thru hole technology as well as wires and cables in accordance with international standards
- Getting textbooks with didactic materials
- Will receive personal, international certificate of finishing IPC-J-STD-001 Certified IPC Specialist.
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